Penggunaan Level Tepung Ubi Kayu Yang Berbeda Terhadap Sifat Fisik Wafer Ransum Komplit Berbasis Jerami Padi

Lestari, Triami (2021) Penggunaan Level Tepung Ubi Kayu Yang Berbeda Terhadap Sifat Fisik Wafer Ransum Komplit Berbasis Jerami Padi. S1 thesis, Universitas Jambi.

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Abstract

Penelitian ini bertujuan untuk mengetahui level terbaik penggunaan tepung ubi kayu sebagai pengikat dalam pembuatan wafer ransum komplit berbasis jerami padi (WRKJP). Penilaian terhadap sifat fisik dilihat melalui 5 parameter, yaitu kerapatan wafer, Wafer Durability Index, kadar air, berat jenis, dan daya serap air. Penelitian ini menggunakan Rancangan Acak Lengkap (RAL) dengan 4 perlakuan yaitu: WRKJP-3 (penggunaan 3% tepung ubi kayu), WRKJP-6 (penggunaan 6% tepung ubi kayu), WRKJP-9 (penggunaan 9% tepung ubi kayu), dan WRKJP-12 (penggunaan 12% tepung ubi kayu). Data yang diperoleh dianalisa statistik dengan sidik ragam (ANOVA) dan jika terdapat perbedaan nilai tengah dilanjutkan dengan uji Polinomial Orthogonal (PO). Hasil penelitian menunjukkan bahwa perlakuan berpengaruh nyata (P<0.05) secara linier terhadap kerapatan wafer dengan persamaan Y = 0.0053x + 0.157, wafer durability index Y = 8.3432x + 3.3019 dan Berat Jenis Y = -0.0093x + 0.8527, tetapi tidak berpengaruh nyata (P>0.05) terhadap kadar air dan daya serap air. Berdasarkan hasil penelitian, dapat disimpulkan bahwa penggunaan level 12% tepung ubi kayu pada wafer ransum komplit berbasis jerami padi menghasilkan sifat fisik terbaik. This research aims to find out the best level of use of cassava flour as a binder in the manufacture of complete ration wafer based on rice straw (WRKJP). Assessment of physical properties is seen through 5 parameters, namely wafer density, Wafer Durability Index, moisture content, spesific gravity, and water absorption. This study used a Complete RandomIzed Design (RAL) with 4 treatments, namely: WRKJP-3 (use of 3% cassava flour), WRKJP-6 (use of 6% cassava flour), WRKJP-9 (use of 9% cassava flour), and WRKJP-12 (use of 12% cassava flour). The data obtained is analyzed statistik with fingerprints (ANOVA) and if there is a difference in the middle value followed by Polynomial Orthogonal (PO) test. The results showed that the treatment had significant effect (P<0.05) linearly on the density of materials with the equation Y = 0.0053x + 0.157, wafer durability index Y = 8.3432x + 3.3019 and spesific gravity Y = -0.0093x + 0.8527, but has no significant effect (P>0.05) on moisture content and water absorption. Based on the research results, it can be concluded that the use of the level of 12% cassava flour produces the best physical properties of rice straw-based complete ration wafer.

Type:	Thesis (S1)
Uncontrolled Keywords:	Tepung Ubi Kayu, Sifat Fisik, Wafer Ransum Komplit
Subjects:	L Education > L Education (General)
Divisions:	Fakultas Peternakan > Peternakan
Depositing User:	LESTARI
Date Deposited:	16 Jun 2021 02:05
Last Modified:	16 Jun 2021 02:05
URI:	https://repository.unja.ac.id/id/eprint/20657

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