EVALUASI PENGGUNAAN BERBAGAI LEVEL TAPIOKA TERHADAP SIFAT FISIK WAFER RANSUM KOMPLIT BERBASIS JERAMI PADI

Sa'ad, M. Qismullah (2021) EVALUASI PENGGUNAAN BERBAGAI LEVEL TAPIOKA TERHADAP SIFAT FISIK WAFER RANSUM KOMPLIT BERBASIS JERAMI PADI. S1 thesis, Universitas Jambi.

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Abstract

Abstrak Penelitian ini bertujuan untuk mengetahui kualitas fisik wafer ransum komplit berbasis jerami padi (WRKJP) menggunakan bahan perekat tapioka pada level yang berbeda. Perbandingan antara jerami padi sebagai sumber serat dengan konsentrat pada WRKJP tersebut adalah 50:50. Penelitian ini menggunakan Rancangan Acak Lengkap (RAL) dengan 4 perlakuan yaitu: WRKJP-3 (Ransum komplit menggunakan 3% Tapioka), WRKJP-6 (Ransum komplit menggunakan 6% Tapioka), WRKJP-9 (Ransum komplit menggunakan 9% Tapioka), WRKJP-12 (Ransum komplit menggunakan 12% Tapioka). Adapun setiap perlakuan diulang sebanyak 5 kali Peubah yang diamati meliputi kadar air, kerapatan wafer, berat jenis, daya serap air dan wafer durability index. Data dianalisis menggunakan Analisis Ragam ANOVA, jika perlakuan berpengaruh nyata maka dilanjutkan Uji Jarak Berganda Duncan. Hasil penelitian menunjukkan bahwa perlakuan berpengaruh nyata (P<0.05) terhadap kerapatan wafer (0.17-0.25 gr/cm) dan wafer durability index (39.52-100%) namun tidak berpengaruh nyata (P>0,05) terhadap kadar air (37.25-38.97 %), berat jenis (0.76-0.83 gr/ml) dan daya serap air (167-188 %). Kadar air berbanding lurus dengan daya serap air namun berbanding terbalik dengan kerapatan, berat jenis dan wafer durability index, semakin tinggi nilai kadar air maka nilai kerapatan bahan dan wafer durabililty index menurun. Berdasarkan hasil penelitian dapat disimpulkan bahwa perekat tapioka dengan perlakuan WRKJP 9% menghasilkan kualitas fisik wafer paling baik. Kata kunci: Tapioka, Kualitas Fisik, Wafer Ransum Komplit, Jerami Padi. Abstract This study aims to find out the physical quality of complete wafer ration based on rice straw (WRKJP) using tapioca adhesive material at different levels. The comparison between rice straw as a source of fiber and concentrate on the WRKJP is 50:50. This study used a Complete RandomIzed Design (RAL) with 4 treatments, namely: WRKJP-3 (Complete ration using 3% Tapioca), WRKJP-6 (Complete ration using 6% Tapioca), WRKJP-9 (Complete ration using 9% Tapioca), WRKJP-12 (Complete ration using 12% Tapioca). The repeated treatment of 5 times the observed change includes moisture content, wafer density, density and water absorption. The data was analyzed using ANOVA Variety Analysis, if the treatment has a real effect then continued Duncan Double Distance Test. The results showed that the treatment had a noticeable effect (P<0.05) on wafer density (0.17-0.25 gr/cm) and wafer durability index (39.52-100%). but has no noticeable effect (P>0.05) on water content (37.25-38.97 %), density (0.76-0.83 gr/ml) and water absorption (167-188 %). Water content is directly proportional to water absorption but inversely proportional to density, density and wafer durability index, the higher the value of moisture content, the density value of materials and wafer durabililty index decreases. Based on the results of the study, it can be concluded that tapioca adhesive with WRKJP treatment 9% produces the best physical quality of wafers. Keyword : Tapioca, Physical quality, wafer complete feed, rice straw

Type:	Thesis (S1)
Uncontrolled Keywords:	Tapioka, Kualitas Fisik, Wafer Ransum Komplit, Jerami Padi.
Subjects:	L Education > L Education (General)
Divisions:	Fakultas Peternakan > Peternakan
Depositing User:	M. QISMULLAH SA'AD
Date Deposited:	16 Jun 2021 02:03
Last Modified:	16 Jun 2021 02:03
URI:	https://repository.unja.ac.id/id/eprint/20660

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